1. College degree or above in Metal Materials, Microelectronic Materials, or Materials Processing
2. 5+ years of bonding-wire (gold, copper, silver, etc.) production and process-management experience
3. Proficient in key process steps such as wire drawing, annealing, and surface treatment
4. Familiar with bonding-wire quality standards (e.g., diameter tolerance, breakage rate, bonding performance)
Requirements
1. Mastery of the full production process from ingot to finished wire for bonding wire
2. Ability to analyze and resolve bonding-wire quality abnormalities (e.g., wire breakage, surface defects)
3. Familiar with technical requirements and industry trends of semiconductor-packaging bonding wire
4. Able to independently manage production lines to ensure yield and on-time delivery
