CORE TECHNOLOGIES

Core Technologies

Deeply engaged in high-performance materials, the company has built a system of 14 core technologies covering the full industry chain of target preparation, metal forming, powder metallurgy and superconducting materials.

1

High-Purity Metal Forming & Microstructure Control Technology

Pretreatment of high-purity copper/aluminum ingots, temperature control during forming, and control of processing method and deformation amount achieve uniform and stable grain structure with grain size ≤70μm (copper) and ≤90μm (aluminum).

2

Rotatable Target Structural Design Technology

High-performance welding in precision small areas under a 10⁻⁴ Pa vacuum environment without deformation or leakage, resolving loose weld-pool structure and coarse grains in rotatable target welding.

3

High-Purity Low-Oxygen Metal Powder Preparation Technology

Custom heating and deoxidation equipment achieves powder purity ≥99.99%, D90 <50μm, oxygen content ≤200ppm, effectively controlling powder agglomeration and grain growth.

4

Large-Size Billet Cold Isostatic Pressing Technology

Elastic mold design under ultra-high pressure presses single-section 2.5–4m square or tubular billets with relative density ≥70% and deformation ≤3mm.

5

Hot Isostatic Pressing (HIP) Canning Technology

High-quality sealed cans of special materials, vacuum degree 10⁻⁴ Pa, leak rate ≤10⁻¹⁰ Pam³/s, relative density ≥99.9%, yield ≥99.5%.

6

Ultra-High-Density Sintering Technology

Combination of ultra-high-temperature atmosphere sintering and hot isostatic pressing achieves purity ≥99.99%, relative density ≥99.9%, grain size ≤30μm for refractory metal and alloy targets.

7

High-Purity Nano ITO Powder Preparation Technology

Liquid precipitation and suspension dispersion, spherical spray drying, achieving purity ≥99.99%, relative density ≥99.8%, grain size ≤5μm.

8

High-Precision Forming Technology for Large-Size High-Density Ceramic Targets

Optimized mold design plus ultra-high-pressure cold isostatic pressing (400 MPa), planar targets ≥1,190mm, rotatable targets ≥1,020mm, relative density ≥99.8%.

9

Sintering Technology for Large-Size High-Density Ceramic Targets

Custom sintering furnace and kiln furniture design, unique sintering curve, resistivity ≤1.5×10⁻⁴ Ω·cm, grain size ≤5μm.

10

Large-Size Target Machining Technology

For the stress-strain characteristics of soft, sticky and brittle materials, dimensional accuracy ±0.02mm, no chipping or cracks.

11

Large-Size Target Bonding Technology

Effective bonding of materials with different thermal expansion coefficients, bonding rate ≥99% for planar targets and ≥98% for rotatable targets.

12

Target Cleaning & Packaging Technology

Surface adsorbate removal plus oxidation protection, no oxidation during storage, short pre-sputtering time, fewer abnormal discharges.

13

Melting & Alloying Technology

High-vacuum multiple consumable arc melting controls element ratios and impurity content, eliminating segregation, porosity and looseness defects, achieving dense, uniformly composed alloy ingots.

14

Multi-Core Composite Processing Technology

Niobium-titanium alloy superconducting core and high-purity oxygen-free copper matrix are precisely assembled and composited, then subjected to multi-pass diameter reduction through bundling drawing, rotary swaging and cold rolling, achieving extreme refinement and uniform dispersion of the superconducting core.

INTELLECTUAL PROPERTY

Patents & Intellectual Property

As of 2026, the company holds 144 granted patents, including 37 invention patents and 107 utility model patents, covering core fields such as target preparation, metal purification and material testing, building a complete IP protection system.

144

Total Granted Patents

Covering target prep · metal purification · material testing

37

Invention Patents

Target preparation & metal purification

107

Utility Model Patents

Equipment & process innovation