IC Target
Omat Advanced Materialss integrated circuit targets cover high-purity sputtering targets for semiconductors such as copper Cu, aluminum Al, titanium Ti, tantalum Ta, and cobalt Co. The purity is ≥99.999%, the grain size is small and uniform, and the orientation consistency is high. It is widely used in wafer manufacturing, packaging, power semiconductors (IGBT, MOSFET), 5G filters, MEMS sensors, third-generation semiconductors (GaN, SiC), infrared optics, semiconductor display fields, etc.
Product List
6 products in total
High Purity Copper Target (Cu Target)
High-purity copper sputtering target for semiconductor chip interconnect layers; purity ≥99.99%, grain size ≤70 μm
High-purity copper sputtering target for semiconductor chip interconnect layers;
High Purity Aluminum Target (Al Target)
High-purity aluminum sputtering target for semiconductor chips; purity ≥99.999%, grain size ≤90 μm
High-purity aluminum sputtering target for semiconductor chips; purity ≥99.999%,
Titanium Target (Ti Target)
High-purity, high-density titanium sputtering target for semiconductor chip barrier layers
High-purity, high-density titanium sputtering target for semiconductor chip barr
Tantalum Target (Ta Target)
Tantalum sputtering target for copper-interconnect diffusion barrier layers in semiconductor chips
Tantalum sputtering target for copper-interconnect diffusion barrier layers in s
Cobalt Target (Co Target)
Cobalt sputtering target for semiconductor chip contact layers; suitable for advanced processes
Cobalt sputtering target for semiconductor chip contact layers; suitable for adv
Phosphorized Copper Anode
High-purity phosphorized copper anode material
High-purity phosphorized copper anode for integrated-circuit electroplating; uni
